Abstract: A new concept for encapsulation of discrete bipolar high-power devices using epoxy mold compound (EMC) is demonstrated on silicon 4.5-kV press-pack fast recovery diodes (FRDs) with wafer ...
High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
Abstract: The applications of wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) in power modules are currently limited by the thermal stability of ...
Bio−Nanotechnology Laboratory, Department of Neuroscience and Pharmacology & Nano−Science Center, University of Copenhagen, Universitetsparken 5, 2100 Copenhagen, Denmark Article Views are the COUNTER ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results