TSMC raises its outlook for the global semiconductor industry, predicting the market will surpass $1.5 trillion by 2030.

As industrial markets address decarbonisation and digitisation, component distributors are now expected to do more.

K3Metrology, a UK-based spin-out from the National Physical Laboratory (NPL), has raised £2.75 million in seed funding to ...

Micron is sampling a new 256GB DDR5 registered dual in-line memory module (RDIMM) to boost AI data centre performance.

TAD Electronics (TAD), developer of low-to-no maintenance electronics, now offers a free electronic design service.

KIOXIA Europe has announced a new series of solid-state drives (SSDs) designed for high-performance client systems.

The UFC23 marks the company’s fourth-generation solution in this field and is designed to meet growing demand for precise ...

ROLEC unveils range of diecast aluminium enclosures designed to protect in‑cab human-machine interface (HMI) systems.

binder has launched a new hybrid connector designed to support “One Cable Automation” systems, combining power supply and ...

Aeva licenses Cadence's Tensilica Vision digital signal processor (DSP) to enhance next generation lidar technology.

TDK has launched a new series of non-isolated DC-DC converters designed for industrial and battery powered applications.

Imec has announced that its ASIC and silicon photonics services division, IC‑Link, has joined TSMC’s 3DFabric Alliance.