Molex Teramount deal adds detachable fibre-to-chip coupling for co-packaged optics in AI and hyperscale data centres ...

Even with the most pessimistic forecast the semiconductor market is set to reach a trillion dollars this year.

Genesis AI introduces GENE-26.5, a robotics foundation model for dexterous manipulation and scalable robot training.

Faraday Future and BIBS launch a Physical AI robotics institute focused on AI training, robot deployment and industry ...

News Europe talks to CEO Mark Luo on taking deployable quantum systems from research breakthroughs to real-world computing.

NVIDIA and Corning partner to expand US optical connectivity and photonics manufacturing for AI infrastructure.

European tech CEOs, including ASML, urge urgent EU policy reform to boost competitiveness, scale AI, and strengthen ...

China silicon wafers push accelerates as Beijing targets 70% domestic wafer sourcing and Eswin expands 12-inch production.

Vector supports NXP CoreRide with embedded software for SDV zonal platforms and series production vehicle programmes.

SEMI Summit in Dresden highlights AI chiplets, hybrid bonding and Europe’s push for advanced semiconductor packaging.

Photonics is rapidly becoming a key technology for AI in the datacentre to significantly reduce the power consumption of AI ...

ESD Alliance 2026 outlook to examine how agentic AI is reshaping chip design, verification, and EDA collaboration.