Researchers at the University of Illinois Urbana-Champaign have developed a way to stack high-performance ...

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

Huawei's new chip design principle focused on boosting transmission speed rather than continuing to shrink semiconductors ...

On Monday, at the 2026 IEEE International Symposium on Circuits and Systems (ISCAS) in Shanghai, He Tingbo, President of HUAWEI's Semiconductor Business Department, presented the Tau (τ) Scaling Law, ...

Learn how William Shockley, John Bardeen, and Walter Brattain invented the transistor in 1947 at Bell Labs and revolutionized ...

The transistor is the basic technology behind, well, everything in modern computing. In digital circuits, a transistor acts ...

By stacking transistors on top of one another, rather than laying them side by side on a flat chip, many electronic engineers ...

Just as Huawei introduced its ambitious “Tau (τ) Law” semiconductor strategy at ISCAS 2026 today, the company also shared more details about its upcoming Kirin mobile processor. In our previous report ...

Huawei unveiled Tau Scaling Law and LogicFolding technology to match TSMC's 1.4nm chip density by 2031 without EUV ...

Over the past decades, electronics engineers worldwide have been trying to develop devices that could enable even faster communications between devices, all while consuming less energy. To meet the ...

By Eduardo Baptista and Che Pan BEIJING, May 29 (Reuters) - Huawei's new chip design principle focused on boosting ...

On Monday, at the 2026 IEEE International Symposium on Circuits and Systems in Shanghai, He Tingbo, President of HUAWEI's ...