Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...

Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...

New power modules have an optimized high-efficiency, compact, and durable design that is ideal for BLDC motor drives The Mega IPM7 series is AOS’ new generation of intelligent power modules engineered ...

Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...