USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions.

Wolfspeed’s 3.3-kV SiC power modules target AI data centers, renewable energy systems, and grid infrastructure.

New high-voltage silicon carbide power modules aim to improve efficiency, reduce losses, and simplify next-generation power ...

Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV‑D3 mSiC® Power Modules, designed to ...

Wolfspeed has introduced two new 3.3 kV silicon carbide (SiC) power module families – including high-power half-bridge ...

Microchip Technology has launched a new range of 3.3 kV silicon carbide (SiC) power modules to support SST designs.

Amkor Technology (NASDAQ:AMKR) outlined a multi-year growth strategy centered on advanced semiconductor packaging, saying the ...

Richardson Electronics, Ltd. (NASDAQ: RELL) today announced a new global strategic partnership with NoMIS Power, a leading designer of advanced silicon carbide (SiC) power semiconductor technologies.

Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV- D3 mSiC Power Modules, designed to simplify and accelerate ...

Microchip Technology has announced the availability of its new 3.3 kV HV‑D3 mSiC Power Modules, designed to simplify and ...

TCL Zhonghuan ("TCL Zhonghuan Renewable Energy Technology Co., Ltd.") announced the launch of its next-generation BC (back-contact) high-efficiency module at its Tianjin manufacturing base this month, ...

Integrating 12-inch CMOS Meta-Lenses into a multi-row 2D array, AuthenX delivers ultra-low loss and high alignment tolerance to seamlessly scale 3.2T to 12.8T CPO deployments. TAIPEI, May 28, 2026 ...