CAS-led researchers developed a peak-selective passivation strategy using aluminum oxide nanocoating to solve leakage issues in pyramid-textured silicon for perovskite–silicon tandem cells. The method ...

With refractory orebodies becoming central to future gold supply, processing solutions with Glencore Tech's Albion Process are moving into focus.

The ultra-thin TOPCon solar cell uses dual-sided polysilicon passivated contacts formed by low-pressure chemical vapor ...

On May 24, JA Solar officially announced a major breakthrough in the HyperGen technology, which is being jointly developed with Golden Stone Energy.

Panel-level packaging has gained momentum in the semiconductor industry as manufacturers pursue higher efficiency and improved yield that can support next-generation packaging processes. In response ...

Novel droplet-based energy harvesting technology converts secondary wastewater effluents into electricity while ...

Asahi Kasei has announced its new photosensitive film for panel-level packaging in the semiconductor industry, combining the ...

Breakthrough alloy unveiled: HKU scientists created SS-H2 stainless steel, resisting seawater electrolysis corrosion far beyond conventional materials. Cost savings potential: Replacing titanium with ...

New photosensitive film combines proven technologies to enhance productivity and yield in semiconductor manufacturing ...

As part of the European pilot line APECS, the Fraunhofer Institute for Photonic Microsystems IPMS has developed a method that fuses various chip components almost seamlessly into a single unit. By ...

Researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allows different chip ...

< 3D printing of a demonstrator for quasi-monolithic integration with a chiplet in the pocket. Copyright: © Fraunhofer IPMS ...