TSMC raises its outlook for the global semiconductor industry, predicting the market will surpass $1.5 trillion by 2030.

K3Metrology, a UK-based spin-out from the National Physical Laboratory (NPL), has raised £2.75 million in seed funding to ...

As industrial markets address decarbonisation and digitisation, component distributors are now expected to do more.

Micron is sampling a new 256GB DDR5 registered dual in-line memory module (RDIMM) to boost AI data centre performance.

TAD Electronics (TAD), developer of low-to-no maintenance electronics, now offers a free electronic design service.

KIOXIA Europe has announced a new series of solid-state drives (SSDs) designed for high-performance client systems.

The UFC23 marks the company’s fourth-generation solution in this field and is designed to meet growing demand for precise ...

ROLEC unveils range of diecast aluminium enclosures designed to protect in‑cab human-machine interface (HMI) systems.

binder has launched a new hybrid connector designed to support “One Cable Automation” systems, combining power supply and ...

TDK has launched a new series of non-isolated DC-DC converters designed for industrial and battery powered applications.

Infineon extends its XHP 2 power module portfolio with new variants based on 2300 V CoolSiC MOSFET technology.

Imec has announced that its ASIC and silicon photonics services division, IC‑Link, has joined TSMC’s 3DFabric Alliance.