The result is that the entire board is much denser, and comments can be installed on both sides of the PC board, as seen in Figure 2 . Since the board does not require drilling for component leads ...

In particular, a new type of packaging defect phenomenon—die-pop—is observed. Vacuum reflow process has been able to reduce the solder void size to minimum value consistently but there is an ...

The objective of this article is to explain the best techniques for soldering sensors manufactured by Merit Sensor using automated equipment. All profiles must be assessed and tested for best ...