SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...
Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...
Whether the discussion is about smart manufacturing or digital transformation, one of the biggest conversations in the semiconductor industry today centers on the tremendous amount of data fabs ...
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