The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
In this interview, Dr. Chady Stephan, PhD, the Applied Markets Leader at PerkinElmer, talks to AZoM about the current trends shaping semiconductor wafer manufacturing. A semiconductor is a material ...
Increased productivity and efficiency with one-pass test enabled by a high-voltage switching matrix Designed to enhance the safety of operators and equipment; complies with regulations SANTA ROSA, ...
FREMONT, CA / ACCESSWIRE / December 14, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an initial customer ...
MUNICH — Electroglas Inc. today at the Semicon Europa trade show here introduced a new test-handling solution for devices in wafer-level packages, unpackaged known-good die products, thin wafers, ...
FREMONT, Calif., March 01, 2021 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it has ...
This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...
Rapidus on Friday announced that it had begun prototyping of test wafers with 2nm gate-all-around (GAA) transistor structures at its IIM-1 facility in Japan. The company confirmed that early test ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results