Tech Times

Samsung 900-Layer NAND Prototype Sets World Record: CMB Technique Doubles Stack Height

Samsung 900-layer NAND prototype — the world’s first — uses Cell Multi-Bonding to fuse two 450-layer wafers into one chip, ...
heise online

Stack memory with 36 GByte per chip: HBM4 mass production from October 2025

The fifth generation of High Bandwidth Memory is currently in use as HBM3E. After SK Hynix delivered samples of the upcoming HBM4 generation with 12 layers of 24 Gbit each back in March, mass ...
TweakTown

SK hynix CEO announces new vision as Full Stack AI Memory Creator: custom HBM, AI DRAM, AI NAND

TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...
Network World

Micron joins HBM4 race with 36GB 12-high stack, eyes AI and data center dominance

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
Business Wire

KIOXIA LC9 Series 245.76 TB Enterprise SSD with Innovative 32-die Stack Memory Named ‘Best of Show’ at FMS: the Future of Memory and Storage 2025

SAN JOSE, Calif.--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) 1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC ...