EDN

Flash and Logic Process Integration

Spansion Inc. and United Microelectronics Corporation announced the joint development of a 40nm process that integrates UMC’s 40nm LP logic process with Spansion® proprietary embedded Charge Trap (eCT ...
EDN

LSI Logic taps TSMC for copper-based process

MILPITAS, Calif. — In a bow to Taiwan's chip-making savvy, LSI Logic Corp. said Tuesday (April 3) that it will tap Taiwan Semiconductor Manufacturing Co. for its copper interconnect and low-k ...
Seeking Alpha

Lightwave Logic Announces Controlled Availability of Silicon Photonics Process Design Kit for Advanced Electro-Optic Polymer Integration

DENVER, COLORADO / ACCESS Newswire / March 28, 2025 / Lightwave Logic, Inc. (LWLG) (the "Company"), a technology platform company leveraging its proprietary electro-optic (EO) polymers to transmit ...
Electronic Design

Could This “2D” Transistor Process Transform Logic and Power Device Production?

CDimension’s technology, which enables semiconductor makers to manufacture arrays of extremely small, fast, and efficient “2D” transistors, has the potential to change what’s possible for both digital ...
Design-Reuse

Virage Logic offers Hi-Performance, Phase Compliant Embedded Memory Products for UMC's Advanced 0.13 Micron Manufacturing Process

Virage Logic achieves 20 percent performance improvement on UMC's 0.13-micron MPU process using patented phase-shifting technology from Numerical Technologies Fremont, CA - May 15, 2002, Virage Logic ...
Design-Reuse

PDF Solutions and Virage Logic Partner to Create Process-Aware Semiconductor IP Libraries

Creation of pDfx-Compliant Libraries Helps Designers Create Better Yielding ICs SAN JOSE, Calif., October 6, 2004 — PDF Solutions, Inc. (Nasdaq: PDFS), the leading provider of semiconductor ...