The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.

A new ultra-compact, stackable power module design drastically raises current delivery limits while shrinking footprint for ...

Modern-day graphics processing units (GPUs) and other AI chips are massive. The unfortunate tradeoff is that they also consume an enormous amount of power, and their power needs are rising ...

Note: This course requires purchase of a parts kit in order to complete assignments. The kit will be used from the first experiment in the 2nd week of class and throughout the course and the following ...