A lack of planarity along the interface between the solder and the ceramic raft in an IGBT module is a common anomaly that can make heat dissipation uneven across the die and cause the die to crack.
Power modules range from heavy-duty IGBTs, thyristors, and GTOs down to relatively low-power IGBT discretes and MOSFETs. Their applications range from rail traction, welding, and marine applications ...
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