SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
The mighty GPU is shaping up to be one of the most significant innovations of human technology during the last few decades. While games such as Alan Wake 2 demonstrate visual chops that can often ...
IEEE Spectrum on MSN
New devices might scale the memory wall
An 8-layer stack of bulk RRAM runs a continually-learning neural network ...
An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing ...
Samsung Electronics is currently dedicated to the R&D of 11nm level DRAM and ninth-generation 3D NAND Flash. The goal is to raise integration to the highest level in the industry, realize its existing ...
Samsungâ s 128 Gbyte DDR4 DIMM internally uses a four-level silicon stack linked via through-silicon vias (TSVs). Stacking DRAM has been part of the high-bandwidth memory (HBM) systems found in ...
GARDEN GROVE, Calif.–DPAC Technologies Corp. here today announced development of a new technology to stack chip-scale packaged memory devices using a fine-pitch ball-grid array (FBGA) interface. DPAC, ...
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