Memory chips used to be considered low-margin commodity products. Now the industry can’t make enough to satisfy data centers’ ...

Samsung ships HBM4 memory at 11.7Gbps speeds and claims an early industry lead ...

With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...

Samsung has officially announced its new HBM4 memory is one of the first to be 'commercially' shipped, ready for 13Gbps and ...

AMD's next-generation 'Halo' APU seems likely to use bleeding-edge LPDDR6 memory for nearly double the bandwidth.

Micron Technology (NasdaqGS:MU) has started building a US$24b advanced wafer fabrication plant in Singapore. The facility is ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

The speed of data transfer between memory and the CPU. Memory bandwidth is a critical performance factor in every computing device because the primary CPU processing is reading instructions and data ...

TL;DR: Samsung Electronics advances its next-gen HBM4E memory with 13Gbps per-pin speeds, delivering up to 3.25TB/sec bandwidth-over 2.5 times faster than HBM3E-and doubling power efficiency. Targeted ...

Samsung has started early mass production of HBM4 chips for Nvidia's next AI platform. Micron Technology (NasdaqGS:MU) is not included as an HBM4 supplier for this Nvidia platform. This development ...

AI doesn't just need memory; it also needs massive storage capacity. Western Digital is a leader in developing advanced 3D ...