Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...

High-frequency electromagnetic simulation has evolved from “wow, now I can see how electromagnetic fields behave” to needing to know how various EM fields interact in large, complex systems. During ...

Direct links to simulation models for 13 of Kyocera AVX’s embedded antennas are available in Ansys HFSS 3D electromagnetic simulation software. As part of Ansys 2023 R1, models include embedded FR4 ...

The author is vice president of engineering, Dielectric LLC. This article is based on a paper prepared for the NAB Broadcast Engineering and IT Conference of the NAB Show and is published with ...

As manufacturers struggle to keep up with demands for smaller, faster, more power-efficient high-performance electronics, one solution from Ansys and Microsoft provides relief. As wireless ...