Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to ...
The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless ...
TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...
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