The number and complexity of design rule checks (DRC) has always increased node over node, but as the semiconductor industry moves towards 20 nm and below, these increases are skyrocketing (Figure 1).

Double patterning (DP) impacts just about every part of the design and manufacturing flows. However, the kinds of issues you encounter, the way they manifest themselves, and the ideal way to address ...

In my last article, we looked at some case studies of the unique types of issues related to double patterning (DP) that place and route (P&R) and chip finishing engineers have to deal with. I’ve got ...