SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...
Intel has unveiled a new packaging innovation for creating 3D chip packages and multiple chip connections ahead of the Semicon West conference in San Francisco this week. The company is detailing its ...
Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...
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