Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

KLAC rides 70% systems revenue surge on advanced packaging and AI chip demand, eyes mid-teen growth in 2026 despite margin ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

Newer technologies such as 3D chips and heterogeneous packaging is pushing the focus towards materials engineering, Prabu Raja, president, of the Semiconductor Products Group at Applied Materials told ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...