Semiconductor packaging is essential to the performance, reliability, and thermal management of modern electronic devices. As ...

The latest edition of the multiphysics simulation magazine, COMSOL News 2026, features stories from users across a variety of ...

BURLINGTON, MA, April 17, 2025 (GLOBE NEWSWIRE) -- COMSOL, a global leader in modeling and simulation software, announced the program for its COMSOL Day: Simulation Apps & Digital Twins event ...

Register by 24 July to secure the early bird rate for the COMSOL Conference 2026 Cambridge and save on your conference ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...

COMSOL version 6.0 delivers performance improvements and simplifies simulation of many important applications, such as printed circuit board (PCB) design (pictured). COMSOL Inc. (Burlington, Mass., ...

COMSOL is getting ready for some big changes -- marked by the release of Multiphysics software version 5.0, which features product updates, three new add-on products, and the "new and revolutionary" ...

COMSOL has introduced Version 4.3a of COMSOL Multiphysics®, its flagship software for modeling and simulating physics-based systems. With version 4.3a and in response to user requests, COMSOL ...

The latest wave of simulation technology releases from Ansys, Cadence, and Avnet underscores a growing convergence of artificial intelligence, cloud computing, and multiphysics modeling in engineering ...

Comsol has upgraded its CAD simulation platform which now includes five new application-specific modules and expanded modeling and analysis tools. This includes the multibody dynamics module used to ...