EDN

Edgebond adhesive enhances board level reliability of large WLCSP’s

Zymet’s reworkable edgebond adhesive, UA-2605-B, has been shown to enhance the board level reliability of a large WLCSP. The work was performed in a collaborative effort between Portland State ...
EDN

Flip chip package extends board-level reliability

Endicott, N.Y.— Endicott Interconnect Technologies has developed a semiconductor package marketed under the brand-name CoreEZ, which uses an organic, thin core build-up flip chip technology that ...
AZoM on MSN

Why board-level insulators and dielectric materials are critical for safe, high-voltage PCB design

Mastering board-level insulation principles like clearance, creepage, and dielectric strength is key to preventing arcing and ensuring long-term dependability.
Electronic Design

Board-Level Qualification Testing for Rad-Hard MOSFET Packaging

High-reliability rad hard MOSFETs undergo extensive screening and quality conformance testing to ensure that devices perform to specification in the harshest environments. For Defense Logistics Agency ...
Semiconductor Engineering

A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials

“The main motivation of this review is to study the evolution of first and second level of interconnect materials used in memory device semiconductor packaging. Evolutions of bonding wires from gold ...