Pulsonix has introduced a direct interface with ADAM Research's TRM software, streamlining thermal simulation for PCB designers. As electronics shrink and power up, TRM's advanced modeling helps ...

Explore the latest advancements in cloud-based mould cooling simulation with Maya HTT and Polygonica. Understand how these technologies optimize injection moulding workflows.

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

The new FloTHERM XT product now supports transient analysis, Joule heating, parametric studies, extended EDA integration capabilities, and new modeling options, including a cutting-edge ability to ...

Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...

The drive for better efficiency in the power electronics industry has generated enormous gains in the last few years. The design of power semiconductors has improved, silicon carbide (SiC) and gallium ...

The Xe-100 is a 200MWt Advanced Pebble Bed Reactor that will be deployed in Washington State in the 2028 timeframe with the support of the US DOE Advanced Reactor Demonstration Program. The Xe-100 has ...