Semiconductor machinery manufacturer Applied Materials (NASDAQ:AMAT) announced in Q4 CY2025, but sales fell by 2.1% year on ...

AI and HPC Fuel Advances in Packaging Technology 3DIC, FOPLP, and Chiplet Forums Gain Global Spotlight To drive global collaboration and next-gen system integration, SEMI will launch the 3DIC Advanced ...

Continued innovation in advanced packaging opens a clearer path to the outcomes the industry prioritizes. By tightening the physical distance between compute, memory, and interconnect, chipmakers ...

Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...

Contrel Technology, an LCD equipment specialist, is increasing its deployment in MicroLED and advanced packaging, which is expected to yield results in 2025. Save my User ID and Password Some ...

Every Wednesday and Friday, TechNode’s Briefing newsletter delivers a roundup of the most important news in China tech, straight to your inbox. Sign up Traditionally, packaging has been considered a ...

Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

The growing difficulty of cramming more features into an SoC is driving the entire chip industry to consider new packaging options, whether that is a more complex, integrated SoC or some type of ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...